Reballing Stencil For IP18 Series Relife RL-044 For A20 and A20 Max Chipsets

The Relife RL-044 (IPZ18) CPU Reballing Stencil is a precision-machined stainless steel BGA stencil designed for reballing the A20 and A20 Max chipsets found in the iPhone 18 series. At just 0.12mm thick, it delivers accurate, consistent solder ball placement for professional micro-soldering and board-level repair.

This all-in-one CPU integrated stencil covers the full iPhone 18 range (IP18-A20 / A20 Max), with clearly laid-out positions for the main processor and surrounding ICs so you can replant tin quickly and cleanly during logic-board repairs. Precision-etched apertures ensure even solder paste application and reliable results every time.

Part of the Relife / Sunshine professional tooling range, this stencil is an essential tool for phone repair technicians and micro-soldering specialists working on the latest Apple devices. Supplied as a single 0.12mm steel stencil.