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Mijing MS1 Hollow Heating Plate For iPhone 18 Pro and 18 Pro Max
Mijing MS1 Hollow Heating Plate For iPhone 18 Pro and 18 Pro Max
- The hollow layout heats the middle layer accurately and keeps surrounding parts away from high heat.
- Supports motherboard separation and bonding on the MS1 platform.
- Part of the Mijing MS1 module range, with plates for iPhone 11 to 18 Pro Max.
- Package contains 1 x Mijing MS1 hollow plate for iPhone 18 Pro and 18 Pro Max.
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The Mijing MS1 hollow plate for iPhone 18 Pro and iPhone 18 Pro Max is a replacement module for the Mijing MS1 host. Each plate is cut to the outline of one board layout, so the heat goes where the work is needed.
The hollow structure heats the middle layer of the board accurately and helps protect the surrounding components from high temperatures. It also supports the separation and bonding of the motherboard layers.
The plate is made for the MS1 host, which accepts modules for iPhone 11 up to iPhone 18 Pro Max. This plate covers the 18 Pro and 18 Pro Max, and other models use their own plate.
It suits repair shops and micro-soldering benches already running the Mijing MS1 platform.
Package Contents:
- 1 x Mijing MS1 hollow plate for iPhone 18 Pro and 18 Pro Max
Product Information:
SKU: mj-ms1-ip18p
Material: Metal
Weight: 0.05kg
Colour: Grey
Item Dimensions (L x W x H): 14cm x 9cm x 1cm
Shipping Information:
Package Dimensions (L x W x H): 18cm x 13cm x 2cm
Ships From: United Kingdom
Country / Region of Manufacture: United Kingdom
