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Middle Layer Reballing Platform 2-in-1 0.12mm for iPhone 18 Pro / Pro Max
Middle Layer Reballing Platform 2-in-1 0.12mm for iPhone 18 Pro / Pro Max
- 0'12mm ultra-thin precision stencil for accurate, uniform solder ball placement.
- Strong magnetic design securely locks the stencil and chip in place during rework.
- Heat dissipation hole design prevents solder bulging and ensures consistent results.
- Package Contents: 1 x AMAOE IP18 2-in-1 reballing platform (positioning plate + 0'12mm stencil).
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AMAOE IP18 2-in-1 Middle Layer Reballing Platform for iPhone 18 Pro and iPhone 18 Pro Max mid-frame soldering and repair. 0.12mm precision with strong magnetic design, compatible with iPhone 18 Pro / Pro Max motherboard middle layer logic board repair and covering the critical repair points on the iPhone 18 Pro series. Ideal for professional repair technicians - the 2-in-1 set streamlines CPU and logic board reballing with precision and efficiency.
Features:
0.12mm Precision Stencil - Ultra-thin thickness ensures accurate, uniform solder ball placement
Strong Magnetic Design - Securely locks the stencil and chip in place for stable alignment during rework
Heat Dissipation Hole Design - Prevents solder bulging and ensures consistent reballing results
IP18 Pro / Pro Max Middle Layer Stencil - Precise stencil for the iPhone 18 Pro / Pro Max motherboard middle layer
Compatibility:
For iPhone 18 Pro and iPhone 18 Pro Max motherboard middle layer / logic board reballing work
Package Contents:
- 1 x AMAOE IP18 2-in-1 0.12mm Middle Layer Reballing Platform (positioning plate + 0.12mm stencil)
Product Information:
SKU: amaoe-ip18pm
Material: Steel
Weight: 0.05kg
Colour: Silver
Item Dimensions (L x W x H): 18cm x 12cm x 2cm
Shipping Information:
Package Dimensions (L x W x H): 18cm x 12cm x 2cm
Ships From: United Kingdom
Country / Region of Manufacture: United Kingdom
