FoneFunShop
2UUL BG01 Reballing Stencil Set for iP 8 to 16 Pro Max Full 4 Piece A B C D Set
2UUL BG01 Reballing Stencil Set for iP 8 to 16 Pro Max Full 4 Piece A B C D Set
Build: Made from stainless steel, resistant to warping under high soldering temperatures.
Design: Laser-cut openings ensure accurate solder ball alignment and consistent re-balling results.
Durable & Reusable: Ultra-thin yet strong enough for repeated professional use.
Size: Compact stencil plates providing full IC coverage while remaining easy to handle.
10 in stock
PRICE INCLUDES 20% VAT
Couldn't load pickup availability
The 2UUL BG01 Re-balling Stencil Set is a professional-grade solution designed for precision motherboard and IC repair on models ranging from iP 8 up to 16 Pro Max. This 4-piece stencil kit provides technicians with the accuracy and reliability required for advanced re-balling and chip-level repair.
Each set includes four stencils (A, B, C, and D), covering the full range of popular Phone CPU, NAND, baseband, and IC's. With this complete set, you can tackle multiple repair tasks without needing to purchase individual stencils, making it both cost-effective and efficient for professional repair shops and skilled technicians.
Crafted from durable, heat-resistant stainless steel, the stencils ensure long-lasting performance even under high temperatures during re-balling and soldering work. The laser-cut design guarantees precise alignment and consistent solder ball placement, reducing errors and improving repair success rates.
The BG01 set is optimized for BGA re-balling, IC positioning, and re-soldering work, giving you the flexibility to restore functionality to phones suffering from chip-level faults such as boot issues, storage problems, or power failures. Its compatibility across multiple phone generations makes it an indispensable tool for repair professionals who demand reliability and accuracy in every repair.
Features:
Full 4-piece set (A, B, C, D) for complete phone IC coverage
Compatible with iP 8 through 16 Pro Max
Precision laser-cut stainless steel for durability and accuracy
Ideal for CPU, NAND, baseband, and power IC re-balling
Heat-resistant, reusable, and designed for professional repair use
Specifications:
Pieces Included: 4 (A, B, C, D)
Compatible Devices: iP 8, 8 Plus, X, XR, XS, XS Max, 11, 11 Pro, 11 Pro Max, 12, 12 Mini, 12 Pro, 12 Pro Max, 13, 13 Mini, 13 Pro, 13 Pro Max, 14, 14 Plus, 14 Pro, 14 Pro Max, 15, 15 Plus, 15 Pro, 15 Pro Max, 16, 16 Pro, 16 Pro Max
Supported IC Types: CPU, NAND, Baseband, Power IC
Material: Stainless Steel
Colour: Silver
Weight: 0.15 kg
Dimensions: 8cm × 8cm × 0.12cm
Whether you are handling routine IC replacements or tackling complex board-level diagnostics, this Stencil Set provides the professional standard you need.
Lightweight yet sturdy, this complete kit is an excellent investment for technicians specializing in motherboard repairs.
Package Content:
1 x 2UUL BG01 Reballing Stencil Set for iP 8 to 16 Pro Max Full 4 Piece A B C D Set
Product Information:
SKU: bgasten-816pm
Material: Metal
Weight: 0.15kg
Colour: Silver
Item Dimensions (L x W x H): 8cm × 8cm × 0.12cm
Shipping Information:
Package Dimensions (L x W x H): 12cm x 8cm x 2cm
Ships From: United Kingdom
Country / Region of Manufacture: United Kingdom
Share