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BGA Reballing For iPhone X Middle Layer Board Frame

BGA Reballing For iPhone X Middle Layer Board Frame

Compatible with iPhone X Only (only for iPhone X).

Used to help you fix the motherboard tightly.

Upper Lower Layers board frame gives best solution for professional phone repair.

High temp resistant and anti-static, Ideal for phone motherboard soldering repair.

Perfect for repairing iPhone X Layered Logic Board

 

Low stock: 3 left

Regular price £5.99
Regular price Sale price £5.99
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PRICE INCLUDES 20% VAT

Compatible with iPhone X Only (only for iPhone X).

Used to help you fix the motherboard tightly.

Upper Lower Layers board frame gives best solution for professional phone repair.

High temp resistant and anti-static, Ideal for phone motherboard soldering repair.

Perfect for repairing iPhone X Layered Logic Board

 

Specification:

Material: Heat resistant resin

Size: Approx. 5 x 2.5 x 0.3 cm

 

Package Contents:

1 x For iPhone X - BGA Reballing Middle Layer Board Frame



Product Information:
SKU: ipx-midframe

Material: Heat Resistant Resin
Weight: 0.01kg, 0.01kg, 0.01kg
Colour: Gold
Dimensions: L: 5cm W: 2.5cm H: 0.3cm

Ships From: United Kingdom, United Kingdom, United Kingdom, United Kingdom
Country / Region of Manufacture: China
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