Mijing High Purity Tin Paste, Model:158

The Mijing High Purity Tin Paste Model 158 is a professional-grade solder paste formulated for mobile phone motherboard repair and BGA chip rework. With a melting point of 158 degrees Celsius, this mid-temperature paste is ideal for lead-free soldering applications where precise temperature control is essential.

Engineered with a high-purity formula, this solder paste delivers excellent wettability and consistent flow characteristics, ensuring stable and reliable solder joints every time. The improved formula reduces the risk of false soldering and cold joints, giving technicians confidence when reballing BGA chips or reflowing components on delicate circuit boards.

The 50g tub features a convenient square mouth opening that makes dispensing easy and precise, while also allowing excess paste to be scraped back into the container to reduce waste. The secure screw-top lid keeps the paste fresh and workable between uses.

Suitable for use with hot air rework stations, preheaters, and reflow equipment, this paste is compatible with a wide range of electronic repair tasks including smartphone motherboard repair, tablet servicing, and general PCB rework.

Package Contents:

• 1 x Mijing High Purity Tin Paste Model 158 (50g)