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Reballing Stencil For iPhone A10 CPU 3D BGA IC

Reballing Stencil For iPhone A10 CPU 3D BGA IC

This 3D planting stencil is thicker than ordinary stencils in the market.

The square holes design makes it easier to take out the formed solder balls.

High success rate of planting tin, the solder balls can be formed once after you are proficient.

Less tendency of deformation makes its using life be longer.
 

Stepped groove design enables this stencil to align with tinning position of IC rapidly.

 

5 in stock

Regular price £23.99
Regular price Sale price £23.99
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PRICE INCLUDES 20% VAT

3D BGA IC Reballing Stencil For A10

This 3D planting stencil is thicker than ordinary stencils in the market.

Less tendency of deformation makes its using life be longer.

Stepped groove design enables this stencil to align with tinning position of IC rapidly.

The square holes design makes it easier to take out the formed solder balls.

This 3D stencil is easy to use no matter you are a new or expert.

High success rate of planting tin, the solder balls can be formed once after you are proficient.



Product Information:
SKU: 3dbga-a10

Material: Metal
Weight: 0.02kg
Colour: Silver
Dimensions: L: n/a W: n/a H: n/a

Ships From: United Kingdom, United Kingdom, United Kingdom, United Kingdom
Country / Region of Manufacture: China
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