Mega-Idea Reballing Stencil for iPhone 18 Pro / Pro Max / Duo - Black No 730

MEGA-IDEA No.730 BGA reballing stencil in black, cut to cover every major IC footprint on the iP 18 Pro / 18 Pro Max / Duo logic boards. A single stencil - sits over the chip pads so solder balls can be deposited cleanly through the laser-cut apertures when reballing CPU, PMIC, baseband, flash and other BGA chips during board-level repair.

Features:

Multi-Model Layout - iP 18 Pro, 18 Pro Max and Duo IC footprints laid out on one sheet

Precision Laser-Cut Apertures - Cut to match the pad pitch of each IC so the balls drop exactly where they should

Thin Stainless Steel Sheet - Sits flush against the PCB for a tight, consistent solder-ball deposit

Mega-Idea No.730 - Part of the Mega-Idea professional reballing stencil range used by board-level repair technicians

Black Finish - Dark laser-marked surface makes it easier to see the pattern against solder-ball colour

Reusable - Clean after each session and the stencil is ready for the next job

Specifications:

Model: No.730
Type: BGA Reballing Stencil
Material: Stainless Steel
Colour: Black
Compatible Boards: iP 18 Pro / 18 Pro Max / Duo
Use: Board-level reballing of CPU, PMIC, baseband, flash and other BGA ICs

Compatibility:

For iP 18 Pro, 18 Pro Max and Duo logic boards. Intended for professional board-level reballing work only. Not a user-serviceable part.

Package Contents:

• 1 x MEGA-IDEA No.730 Reballing Stencil - iP 18 / Pro / Max / Duo - Black