Reballing Stencil For iPhone 16 A18/A18Pro IC CPU 0.12mm Relife RL-044 IPZ15

Precision Reballing for iPhone 16 A18/A18Pro

This Reballing Stencil, meticulously crafted by Relife, is specifically designed for the iPhone 16 A18/A18Pro IC CPU. Its advanced 0.12mm thickness ensures accurate placement of solder balls, making it a crucial tool for professional repair technicians.

Key Features:
Model: RL-044 IPZ15
Compatibility: iPhone 16 A18/A18Pro IC CPU
Thickness: 0.12mm
Material: High-quality stainless steel

Why Choose Relife:
Exceptional Accuracy: The 0.12mm thickness ensures the stencil aligns perfectly with the IC CPU pads, guaranteeing accurate solder ball placement.
Durable Construction: Made from robust stainless steel, the stencil is built to withstand repeated use, ensuring longevity and reliability.
Professional Quality: Relife is a trusted name in the electronics repair industry, known for producing high-quality tools like this reballing stencil.
Streamlined Reballing: This stencil simplifies the reballing process, allowing for efficient and precise application of solder balls.
Essential for Repairs: It's a crucial tool for professionals who repair iPhones, enabling them to perform intricate IC CPU reballing procedures with confidence.

Package Content:
1 x Reballing Stencil For For iPhone 16 A18/A18Pro IC CPU T:0.12mm Relife RL-044 IPZ15