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Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3

Reballing Stencil For iPhone 7 7 Plus A10 CPU Mijing BGA IPH 3

8 in stock

Regular price £4.99
Regular price Sale price £4.99
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SKU:

SKU:mijingsten-iph3

Description:

MIJING BGA Stencil is a High Precision BGA Reballing Template for iPhone 7, 7 Plus & A10 CPU and can be used with direct heat. This is a required tool for reballing ic's on iPhone 7, 7 Plus & A10 CPU logic boards.

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