Reballing Stencil For MSM 8992A 8976A 8996A Qualcom CPU Mijing BGA qu1

The MIJING QU1 is a high precision BGA reballing stencil for the Qualcomm MSM8992A, MSM8976A and MSM8996A CPUs. It is the template to use when you need to put a fresh set of solder balls on one of these chips after removing it from the board.

The apertures are cut to match the ball layout of these three Qualcomm processors, so each ball lands on its pad and the reball comes out even. The stencil can be used with direct heat, so you can heat through it with hot air once the apertures are filled.

Use it with solder paste or solder balls and your normal hot air set-up. Clean it after each job and it can be used again.

Features:

• High precision: apertures match the MSM8992A, MSM8976A and MSM8996A ball layout
• Direct heat: heat through the stencil once the apertures are filled
• Three chips, one stencil: covers three Qualcomm CPUs
• Reusable: clean it after use and keep it for the next job

Specifications:

• Brand: MIJING
• Model: QU1
• Type: BGA reballing stencil
• For: Qualcomm MSM8992A, MSM8976A, MSM8996A CPU
• Heating: direct heat

Package Contents

• 1 x MIJING QU1 BGA reballing stencil